细胞外基质&粘附因子基因表达PCR芯片可用于研究对细胞-细胞和细胞-基质相互作用的84个基因的表达。该芯片包含ECM蛋白，包括基底膜成分，胶原蛋白，基因和其他基因定义的ECM结构；基质和重构ECM的其他金属蛋白酶，及其抑制剂；整合素，选择素，细胞粘附分子家族成员（ICAM，ECAM，NCAM，PECAM，和VCAM），其他对细胞粘附和细胞骨架连接起重要作用的基因，如连环蛋白。通过实时定量PCR的方法，研究者即能够利用该芯片简单可靠地同时检测与细胞粘附和ECM相关的基因表达。
Cell Adhesion Molecules: Transmembrane Molecules: CD44, CDH1, HAS1, ICAM1, ITGA1, ITGA2, ITGA3, ITGA4, ITGA5, ITGA6, ITGA7, ITGA8, ITGAL, ITGAM, ITGAV, ITGB1, ITGB2, ITGB3, ITGB4, ITGB5, MMP14, MMP15, MMP16, NCAM1, PECAM1, SELE, SELL, SELP, SGCE, SPG7, VCAM1.
Cell-Cell Adhesion: CD44, CDH1, COL11A1, COL14A1, COL6A2, CTNND1, ICAM1, ITGA8, VCAM1.
Cell-Matrix Adhesion: ADAMTS13, CD44, ITGA1, ITGA2, ITGA3, ITGA4, ITGA5, ITGA6, ITGA7, ITGA8, ITGAL, ITGAM, ITGAV, ITGB1, ITGB2, ITGB3, ITGB4, ITGB5, SGCE, SPP1, THBS3.
Other Adhesion Molecules: CNTN1, COL12A1, COL15A1, COL16A1, COL5A1, COL6A1, COL7A1, COL8A1, VCAN, CTGF, CTNNA1, CTNNB1, CTNND2, FN1, KAL1, LAMA1, LAMA2, LAMA3, LAMB1, LAMB3, LAMC1, THBS1, THBS2, CLEC3B, TNC, VTN.
Extracellular Matrix Proteins: Basement Membrane Constituents: COL4A2, COL7A1, LAMA1, LAMA2, LAMA3, LAMB1, LAMB3, LAMC1, SPARC.
Collagens & ECM Structural Constituents: COL11A1, COL12A1, COL14A1, COL15A1, COL16A1, COL1A1, COL4A2, COL5A1, COL6A1, COL6A2, COL7A1, COL8A1, FN1, KAL1.
ECM Proteases: ADAMTS1, ADAMTS13, ADAMTS8, MMP1, MMP10, MMP11, MMP12, MMP13, MMP14, MMP15, MMP16, MMP2, MMP3, MMP7, MMP8, MMP9, SPG7, TIMP1.
ECM Protease Inhibitors: COL7A1, KAL1, THBS1, TIMP1, TIMP2, TIMP3.
Other ECM Molecules: VCAN, CTGF, ECM1, HAS1, SPP1, TGFBI, THBS2, THBS3, CLEC3B, TNC, VTN.