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Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor†
Alexander Hanss,Omid Mokhtari,Sri Krishna Bhogaraju,Gordon Elger
New Journal of Chemistry Pub Date : 10/24/2018 00:00:00 , DOI:10.1039/C8NJ04173C
Abstract

The use of formic acid vapor in soldering is growing. In the presence of SnAgCu powder, used as a bonding material to replace Pb-containing alloys, undesired deposits are observed. To understand this phenomenon, the mass change of a sample of alloys was investigated between 40 and 260 °C and the evolved gas was analyzed. In the quest to identify the unwanted deposits, a new strategy was researched and developed to increase the quantity of the produced deposit and to obtain it on a target surface for further studies. Unexpectedly, crystals were produced. The growth process of the crystals was optimized to reach crystal structures at nearly 1 mm in height. Unusual shapes were detected.

Graphical abstract: Formation of tin-based crystals from a SnAgCu alloy under formic acid vapor
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