Cu-based printing inks (20 wt% Cu) and (9.6 wt% Cu) were prepared using the short carbon chain organic Cu-precursors formed during the preparation of the inks, which can easily form a favorable conductive film onto glass slides at 290 째C and 220 째C. The resistance of the film induced by the oxidation of Cu and the remainder of the long carbon chain Cu-precursors markedly decreased, more than usual. The factors influencing the formation and conductive mechanism of the copper ink and film are discussed.