The curing kinetics between PGN and N100 were studied by Fourier transform infrared spectroscopy and dynamic torsional vibration method. The results showed that the entire curing process of adhesives was divided into three stages. Infrared spectroscopy can only monitor the first and second stages, while dynamic torsional vibration method monitors the second and third stages. Combining the two analysis methods allows the complete monitoring of the entire curing process in this system. Besides, differential scanning calorimeter is not suitable for studying this process.