An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture†
Alberto Martínez-Otero,Quan Liu,Paola Mantilla-Perez,Miguel Montes Bajo
Journal of Materials Chemistry A Pub Date : 04/17/2015 00:00:00 , DOI:10.1039/C5TA02205C
Abstract

We report a thin and robust interconnecting layer (ICL) for polymer tandem solar cells. This ICL shows low absorption, good electrical contacts, large work function contrast and robustness. Its use yields tandem cells with a very high fill factor of 76%, making this ICL a promising component of future highly efficient multijunction organic solar cells.

Graphical abstract: An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture