The multi-chiplet technique is expected to be a promising solution to achieve high-density system integration with low power consumption and high usage ratio. This technique can be integrated with a glass interposer to accomplish a competitive low fabrication cost compared with the silicon-based interposer architecture. In this study, process-oriented stress simulation is performed by the element activation and deactivation technique in finite element analysis architecture. The submodeling technique is also utilized to mostly conquer the scale mismatch and difficulty in mesh gridding design. It is also used to analyze the thermomechanical responses of glass interposers with chiplet arrangements and capped epoxy molding compounds (EMC) during curing. A three-factor, three-level full factorial design is applied using the analysis of variance method to explore the significance of various structural design parameters for stress generation. Analytic results reveal that the maximum first principal stresses of 130.75 and 17.18 MPa are introduced on the sidewall of Cu-filled via and the bottom of the glass interposer, respectively. Moreover, the EMC thickness and through glass via pitch are the dominant factors in the adopted vehicle. They significantly influence the stress magnitude during heating and cooling.

In high-integration electronic components, the insulated-gate bipolar transistor (IGBT) power module has a high working temperature, which requires reasonable thermal analysis and a cooling process to improve the reliability of the IGBT module. This paper presents an investigation into the heat dissipation of the integrated microchannel cooling plate in the silicon carbide IGBT power module and reports the impact of the BL series micropump on the efficiency of the cooling plate. The IGBT power module was first simplified as an equivalent-mass block with a mass of 62.64 g, a volume of 15.27 cm3, a density of 4.10 g/cm3, and a specific heat capacity of 512.53 J/(kg·K), through an equivalent method. Then, the thermal performance of the microchannel cooling plate with a main channel and a secondary channel was analyzed and the design of experiment (DOE) method was used to provide three factors and three levels of orthogonal simulation experiments. The three factors included microchannel width, number of secondary inlets, and inlet diameter. The results show that the microchannel cooling plate significantly reduces the temperature of IGBT chips and, as the microchannel width, number of secondary inlets, and inlet diameter increase, the junction temperature of chips gradually decreases. The optimal structure of the cooling plate is a microchannel width of 0.58 mm, 13 secondary inlets, and an inlet diameter of 3.8 mm, and the chip-junction temperature of this structure is decreased from 677 °C to 77.7 °C. In addition, the BL series micropump was connected to the inlet of the cooling plate and the thermal performance of the microchannel cooling plate with a micropump was analyzed. The micropump increases the frictional resistance of fluid flow, resulting in an increase in chip-junction temperature to 110 °C. This work demonstrates the impact of micropumps on the heat dissipation of cooling plates and provides a foundation for the design of cooling plates for IGBT power modules.

Nanobodies (Nbs) are known as camelid single-domain fragments or variable heavy chain antibodies (VHH) that in vitro recognize the antigens (Ag) similar to full-size antibodies (Abs) and in vivo allow immunoreactions with biomolecule cavities inaccessible to conventional Abs. Curently, Nbs are widely used for clinical treatments due to their remarkably improved performance, ease of production, thermal robustness, superior physical and chemical properties. Interes-tingly, Nbs are also very promising bioreceptors for future rapid and portable immunoassays, compared to those using unstable full-size antibodies. For all these reasons, Nbs are excellent candidates in ecological risk assessments and advanced medicine, enabling the development of ultrasensitive biosensing platforms. In this review, immobilization strategies of Nbs on conductive supports for enhanced electrochemical immune detection of food contaminants (Fcont) and human biomarkers (Hbio) are discussed. Interes-tingly, in the case of Fcont, the direct competitive immunoassay detection using coating antigen solid surface is the most commonly used approach for efficient Nbs capture which was characterized with cyclic voltammetry (CV) and differential pulse voltammetry (DPV) when the signal decays for increasing concentrations of free antigen prepared in aqueous solutions. In contrast, for the Hbio investigations on thiolated gold electrodes, increases in amperometric and electrochemical impe-dance spectroscopy (EIS) signals were recorded, with increases in the antigen concentrations prepared in PBS or spiked real human samples.

This study examines the impact of surface defects on the electro-explosive properties of metal explosive foil transducers. Specifically, it focuses on the effects of defects in the bridge foil and their influence on the electrical explosion time and transduction efficiency. To analyze these effects, a current-voltage simulation model is developed to simulate the behavior of a defective bridge foil. The simulation results are validated through experimental current-voltage measurements at both ends of the bridge area. The findings reveal that the presence of through-hole defects on the surface of the bridge foil leads to an advancement in the electrical explosion time and a reduction in the transduction efficiency of the bridge foil. A performance comparison is made between the defective bridge foil and a defect-free copper foil. As observed, a through-hole defect with a radius of 20 μm results in a 1 ns advance in the blast time and a 1.52% decrease in energy conversion efficiency. Similarly, a through-hole defect with a radius of 50 μm causes a 51 ns advancement in the blast time and a 13.96% reduction in the energy conversion efficiency. These findings underscore the detrimental effects of surface defects on the electro-explosive properties, emphasizing the importance of minimizing defects to enhance their performance.

With the advancement of semiconductor technology, chip cooling has become a major obstacle to enhancing the capabilities of power electronic systems. Traditional electronic packaging materials are no longer able to meet the heat dissipation requirements of high-performance chips. High thermal conductivity (TC), low coefficient of thermal expansion (CTE), good mechanical properties, and a rich foundation in microfabrication techniques are the fundamental requirements for the next generation of electronic packaging materials. Currently, metal matrix composites (MMCs) composed of high TC matrix metals and reinforcing phase materials have become the mainstream direction for the development and application of high-performance packaging materials. Silicon carbide (SiC) is the optimal choice for the reinforcing phase due to its high TC, low CTE, and high hardness. This paper reviews the research status of SiC-reinforced aluminum (Al) and copper (Cu) electronic packaging materials, along with the factors influencing their thermo-mechanical properties and improvement measures. Finally, the current research status and limitations of conventional manufacturing methods for SiC-reinforced MMCs are summarized, and an outlook on the future development trends of electronic packaging materials is provided.

This paper proposes a highly sensitive and high-resolution resonant MEMS electrostatic field sensor based on electrostatic stiffness perturbation, which uses resonant frequency as an output signal to eliminate the feedthrough interference from the driving voltage. The sensor is composed of a resonator, driving electrode, detection electrode, transition electrode, and electrostatic field sensing plate. The working principle is that when there is an electrostatic field, an induction charge will appear at the surface of the electrostatic field sensing plate and induce electrostatic stiffness on the resonator, which will cause a resonant frequency shift. The resonant frequency is used as the output signal of the microsensor. The characteristics of the electrostatic field sensor are analyzed with a theoretical model and verified by finite element simulation. A device prototype is fabricated based on the Silicon on Insulator (SOI) process and tested under vacuum conditions. The results indicate that the sensitivity of the sensor is 0.1384Hz/(kV/m) and the resolution is better than 10 V/m.

Aiming at the shortcomings of the traditional engineering experience in designing thin-film heat flow meters, such as low precision and long iteration time, the finite element analysis model of thin-film heat flow meters is established based on finite element simulation methods, and a double-type thin-film heat flow sensor based on a copper/concentrate thermopile is made. The influence of the position of the thermal resistance layer, heat flux density and thickness of the thermal resistance layer on the temperature gradient of the hot and cold ends of the heat flow sensor were comprehensively analyzed by using a simulation method. When the applied heat flux density is 50 kW/m2 and the thermal resistance layer is located above and below the thermopile, respectively, the temperature difference between the hot junction and the cold junction is basically the same, but comparing the two, the thermal resistance layer located above is more suitable for rapid measurements of heat flux at high temperatures. In addition, the temperature difference between the hot and cold contacts of the thin-film heat flux sensor increases linearly with the thickness of the thermal resistance layer. Finally, we experimentally tested the response–recovery characteristics of the sensors, with a noise of 2.1 μV and a maximum voltage output of 15 μV in a room temperature environment, respectively, with a response time of about 2 s and a recovery time of about 3 s. Therefore, the device we designed has the characteristic of double-sided use, which can greatly expand the scope of use and service life of the device and promote the development of a new type of heat flow meter, which will provide a new method for the measurement of heat flow density in the complex environment on the surface of the aero-engine.

Titanium dioxide has attracted a great deal of attention in the field of environmental purification due to its photocatalytic activity under ultraviolet light. Photocatalytic efficiency and the energy required to initiate the process remain the drawbacks that hinder the widespread adoption of the process. Consistently with this, it is proposed here the polymerization of hexamethyldisiloxane fragments simultaneously to TiO2 sputtering for the production of thin films in low-pressure plasma. The effect of plasma excitation power on the molecular structure and chemical composition of the films was evaluated by infrared spectroscopy. Wettability and surface energy were assessed by a sessile drop technique, using deionized water and diiodomethane. The morphology and elemental composition of the films were determined using scanning electron microscopy and energy dispersive spectroscopy, respectively. The thickness and roughness of the resulting films were measured using profilometry. Organosilicon-to-silica films, with different properties, were deposited by combining both deposition processes. Titanium was detected from the structures fabricated by the hybrid method. It has been observed that the proportion of titanium and particles incorporated into silicon-based matrices depends on the plasma excitation power. In general, a decrease in film thickness with increasing power has been observed. The presence of Ti in the plasma atmosphere alters the plasma deposition mechanism, affecting film deposition rate, roughness, and wettability. An interpretation of the excitation power dependence on the plasma activation level and sputtering yield is proposed. The methodology developed here will encourage researchers to create TiO2 films on a range of substrates for their prospective use as sensor electrodes, water and air purification systems, and biocompatible materials.

In recent years, biometric radar has gained increasing attention in the field of non-touch vital sign monitoring due to its high accuracy and strong ability to detect fine-grained movements. However, most current research on biometric radar can only achieve heart rate or respiration rate monitoring in static environments, which have strict monitoring requirements and single monitoring parameters. Moreover, most studies have not applied the collected data despite their significant potential for applications. In this paper, we introduce a non-touch motion-robust vital sign monitoring system via ultra-wideband (UWB) radar based on deep learning. Nmr-VSM not only enables multi-dimensional vital sign monitoring under human motion environments but also implements cardiac anomaly detection. The design of Nmr-VSM includes three key components. Firstly, we design a UWB radar that can perform multi-dimensional vital sign monitoring, including heart rate, respiratory rate, distance, and motion status. Secondly, we collect real experimental data and analyze the impact of eight factors, such as motion status and distance, on heart rate monitoring. We then propose a deep neural network (DNN)-based heart rate data correction model that achieves high robustness in motion environments. Finally, we model the heart rate variability (HRV) of the human body and propose a convolutional neural network (CNN)-based anomaly detection model that achieves low-latency detection of heart diseases, such as ventricular tachycardia and ventricular fibrillation. Experimental results in a real environment demonstrate that Nmr-VSM can not only accurately monitor heart rate but also achieve anomaly detection with low latency.

This study developed and implemented a driving power supply for light-emitting diode (LED) array streetlamps. The power stage was a quasi-resonant (QR)-flyback converter, its input power was the alternating-current power, and the LED array streetlamp was driven by the direct-current output power. The developed QR-flyback converter was operated in discontinuous conduction mode, and the pulse-width modulation (PWM) control chip was used to switch and conduct at the resonant valley of the drain-source voltage on the metal-oxide-semiconductor field-effect transistor (MOSFET) switch to reduce the switching loss. Moreover, the PWM control chip had a disable function, which was connected with a bright and extinguishable control circuit, and the high/low voltage level signal output by the Arduino development board can be used to control the output power of the QR-flyback converter, achieving bright and extinguishable controls for the LED array streetlamp.

Due to the brittleness of silicon, the use of a diamond wire to cut silicon wafers is a critical stage in solar cell manufacturing. In order to improve the production yield of the cutting process, it is necessary to have a thorough understanding of the phenomena relating to the cutting parameters. This research reviews and summarizes the technology for the precision machining of monocrystalline silicon using diamond wire sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), the finite element method (FEM), and other methods used for studying the principle of DWS are compared. Secondly, the equipment used for DWS is reviewed, the influences of the direction and magnitude of the cutting force on the material removal rate (MRR) are analyzed, and the improvement of silicon wafer surface quality through optimizing process parameters is summarized. Thirdly, the principles and processing performances of three assisted machining methods, namely ultrasonic vibration-assisted DWS (UV-DWS), electrical discharge vibration-assisted DWS (ED-DWS), and electrochemical-assisted DWS (EC-DWS), are reviewed separately. Finally, the prospects for the precision machining of monocrystalline silicon using DWS are provided, highlighting its significant potential for future development and improvement.

To meet the measurement needs of multidimensional high-g acceleration in fields such as weapon penetration, aerospace, and explosive shock, a biaxial piezoresistive accelerometer incorporating tension–compression is meticulously designed. This study begins by thoroughly examining the tension–compression measurement mechanism and designing the sensor’s sensitive structure. A signal test circuit is developed to effectively mitigate cross-interference, taking into account the stress variation characteristics of the cantilever beam. Subsequently, the signal test circuit of anti-cross-interference is designed according to the stress variation characteristics of the cantilever beam. Next, the finite element method is applied to analyze the structure and obtain the performance indices of the range, vibration modes, and sensitivity of the sensor. Finally, the process flow and packaging scheme of the chip are analyzed. The results show that the sensor has a full range of 200,000 g, a sensitivity of 1.39 µV/g in the X direction and 1.42 µV/g in the Y direction, and natural frequencies of 509.8 kHz and 510.2 kHz in the X and Y directions, respectively.

In the present paper, we investigate how the reductions in shear stresses and pressure losses in microfluidic gaps are directly linked to the local characteristics of cell-free layers (CFLs) at channel Reynolds numbers relevant to ventricular assist device (VAD) applications. For this, detailed studies of local particle distributions of a particulate blood analog fluid are combined with wall shear stress and pressure loss measurements in two complementary set-ups with identical flow geometry, bulk Reynolds numbers and particle Reynolds numbers. For all investigated particle volume fractions of up to 5%, reductions in the stress and pressure loss were measured in comparison to a flow of an equivalent homogeneous fluid (without particles). We could explain this due to the formation of a CFL ranging from 10 to 20 μm. Variations in the channel Reynolds number between Re = 50 and 150 did not lead to measurable changes in CFL heights or stress reductions for all investigated particle volume fractions. These measurements were used to describe the complete chain of how CFL formation leads to a stress reduction, which reduces the apparent viscosity of the suspension and results in the Fåhræus–Lindqvist effect. This chain of causes was investigated for the first time for flows with high Reynolds numbers (Re∼100), representing a flow regime which can be found in the narrow gaps of a VAD.

Bubble-propelled Janus micromotors have attracted extensive attention in recent years and have been regarded as powerful tools in the environmental and medical fields due to their excellent movement ability. The movement ability can mainly be attributed to the periodic growth, detachment, and/or collapse of the bubble. However, subjected to the experimental conditions, the mechanism of bubble evolution on the motion of the micromotor could not be elucidated clearly. In this work, a finite element method was employed for exploring the role of bubble evolution in bubble-propelled Janus micromotors, which emphasized the growth and collapse of bubbles. After the proposed model was verified by the scallop theorem, the influence of the growth and rapid collapse of bubbles on micromotors was investigated. Results show that the growth and collapse of a bubble can drive the micromotor to produce a displacement, but the displacement caused by a bubble collapse is significantly greater than that caused by bubble growth. The reasons for this phenomenon are analyzed and explained. In addition to the influence of bubble size, the collapse time of the bubble is also investigated.

Gold nanoparticles (AuNPs) and carbon nanotubes (CNTs) are increasingly being investigated for cancer management due to their physicochemical properties, low toxicity, and biocompatibility. This study used an eco-friendly technique (laser synthesis) to fabricate AuNP and Au/CNT nanocomposites. AuNPs, Au/CNTs, and CNTs were tested as potential cancer nanotherapeutics on colorectal carcinoma cells (HCT-116) and cervical cancer cells (HeLa) using a 3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyl-2H-tetrazolium bromide (MTT) assay. In addition, the non-cancer embryonic kidney cells HEK-293 were taken as a control in the study. The cell viability assay demonstrated a significant reduction in cancer cell population post 48 h treatments of AuNPs, and Au/CNTs. The average cell viabilities of AuNPs, Au/CNTs, and CNTs for HCT-116 cells were 50.62%, 65.88%, 93.55%, and for HeLa cells, the cell viabilities were 50.88%, 66.51%, 91.73%. The cell viabilities for HEK-293 were 50.44%, 65.80%, 93.20%. Both AuNPs and Au/CNTs showed higher cell toxicity and cell death compared with CNT nanomaterials. The treatment of AuNPs and Au/CNTs showed strong inhibitory action on HCT-116 and HeLa cells. However, the treatment of CNTs did not significantly decrease HCT-116 and HeLa cells, and there was only a minor decrease. The treatment of AuNPs, and Au/CNTs, on normal HEK-293 cells also showed a significant decrease in cell viability, but the treatment of CNTs did not produce a significant decrease in the HEK-293 cells. This study shows that a simplified synthesis technique like laser synthesis for the preparation of high-purity nanomaterials has good efficacy for possible future cancer therapy with minimal toxicity.

The edge coupler is an indispensable optical device for connecting an external fiber and on-chip waveguide. The coupling efficiency of the edge coupler affects the effective integration of optical circuits. In this study, three-dimensional (3D) edge couplers with high efficiency and tolerance are proposed. The high coupling efficiency of the 3D edge couplers is verified by theoretical calculations. Three couplers are fabricated on a thick-silicon platform via 3D grayscale lithography. At the 1550 nm band, the fiber-to-chip experimental data show that the maximum coupling efficiencies of the three edge couplers are 0.70 dB and 1.34 dB, 0.80 dB and 1.60 dB, and 1.00 dB and 1.14 dB for the TE and TM modes, respectively. At the 1550 nm band, misalignment tolerances measurement data reveal 0.8 dB/0.9 dB tolerance of ±5 μm in the horizontal direction, and 1.7 dB/1.0 dB tolerance of ±2 μm in the vertical direction for TE/TM mode. This study provides a new idea for the design of 3D edge couplers and demonstrates significant superiority in research and industrial applications.

The present paper intends to provide an analysis of how the process of calefaction occurs in a selective catalytic reduction (SCR) system and the mechanisms by which the deposition of AdBlue crystals on a hot surface evolve. Experimentally, two aluminium samples heated to 200 °C were used, over which AdBlue droplets with different atomisation rates were dropped, maintaining the same dynamic flow parameters, in order to observe the influence of temperature effects on the degree of deposition of crystallised sediment on the surface. The authors proposed the use of calefaction in an ultrasonic environment to prevent deposition and to increase droplet fragmentation by a break-up process. To prove the performance of this method one sample was subjected to a normal flow regime while a second sample was exposed to ultrasound. Both samples were assembled on a magneto-strictive concentrator operating at a frequency of 20 kHz. The obtained results indicated that the sample exposed to ultrasound demonstrated lower urea crystallisation compared to the sample that was not exposed to this treatment. Thus, it can be seen that the proposed method of injecting AdBlue into an ultrasonic zone gives the desired results.

Given the rapid progress and widespread adoption of advanced energy storage devices, there has been a growing interest in aqueous capacitors that offer non-flammable properties and high safety standards. Consequently, extensive research efforts have been dedicated to investigating zinc anodes and low-cost carbonaceous cathode materials. Despite these efforts, the development of high-performance zinc-ion capacitors (ZICs) still faces challenges, such as limited cycling stability and low energy densities. In this study, we present a novel approach to address these challenges. We introduce a three-dimensional (3D) conductive porous carbon framework cathode combined with zinc anode cells, which exhibit exceptional stability and durability in ZICs. Our experimental results reveal remarkable cycling performance, with a capacity retention of approximately 97.3% and a coulombic efficiency of nearly 100% even after 10,000 charge–discharge cycles. These findings represent significant progress in improving the performance of ZICs.

Elements of micromachines can be driven by light, including structured light with phase and/or polarization singularities. We investigate here a paraxial vector Gaussian beam with an infinite number of polarization singularities residing evenly on a straight line. The intensity distribution is derived analytically and the polarization singularities are shown to exist only in the initial plane and in the far field. The azimuthal angle of the polarization singularities is shown to increase in the far field by π/2. We obtain the longitudinal component of the spin angular momentum (SAM) density and show that it is independent of the azimuthal angle of the polarization singularities. Upon propagation in free space, an infinite number of C-points is generated, where polarization is circular. We show that the SAM density distribution has a shape of four spots, two with left and two with right elliptic polarization. The distance to the transverse plane with the maximal SAM density decreases with decreasing distance between the polarization singularities in the initial plane. Generating such alternating areas with positive and negative SAM density, despite linear polarization in the initial plane, manifests the optical spin Hall effect. Application areas of the obtained results include designing micromachines with optically driven elements.

In this paper, a novel dual-mass MEMS piezoelectric vector hydrophone is proposed to eliminate the transverse effect and solve the problem of directivity offset in traditional single-mass MEMS piezoelectric vector hydrophones. The reason for the directional offset of the traditional single-mass cantilever MEMS piezoelectric vector hydrophone is explained theoretically for the first time, and the angle of the directional offset is predicted successfully. Both analytical and finite element methods are employed to analyze the single-mass and dual-mass cantilever MEMS piezoelectric vector hydrophone. The results show that the directivity of the dual-mass MEMS piezoelectric vector hydrophone has no deviation, the transverse effect is basically eliminated, and the directivity (maximum concave point depth) is significantly improved, so more accurate positioning can be obtained.